Molybdenum Copper Mocu Sheet Plate

Basic Info

Model NO.	MoCu
Grade	Mo60cu40, Mo70cu30, Mo80cu20
Surface	Ground Polished
Size	as Required
Advantage	Professional
Certificate	ISO9001:2000
Transport Package	Wooden Boxes
Specification	(0.1-20)*W*L
Trademark	Tongchang
Origin	China
HS Code	8101999000
Production Capacity	4t/Month

Product Description

MoCu alloy is a kind of pseudo-alloy that is composed of molybdenum and copper. It consists of both the characteristics of molybdenum and copper, having high thermal conductivity, low adjusted thermal expansion coefficient, Beijing non-magnetic, low content of gas, good vacuum resistance, good machinability and special high-temperature performance, etc.

Compared with WCu alloy, MoCu alloy has lower density and is easier to stamp, It makes MoCu suitable for valume produce.

Product Brief Introduction:

Mo-Cu composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.

Surface: Plating Ni, NiAu, NiAg, or Non-plating

Product Properties:

Material	Wt% Molybdenum Content	Wt% Copper Content	g/cm3 Density at 20ºC	Thermal conductivity at 25ºC	Coefficient of thermal expansion at 20ºC
Mo85Cu15	85± 1	Balance	10	160 - 180	6.8
Mo80Cu20	80 ± 1	Balance	9.9	170 - 190	7.7
Mo70Cu30	70 ± 1	Balance	9.8	180 - 200	9.1
Mo60Cu40	60 ± 1	Balance	9.66	210 - 250	10.3
Mo50Cu50	50 ±0.2	Balance	9.54	230 - 270	11.5

Applications:
These composite are widely used in applications, such as, optoelectronics packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.